The FIB is mainly used for the site-specific material removal and SEM enables non-destructive imaging. The dual beams are multi-functional systems and can be used for sample preparation, microscopy applications and micro-machining. The most common sample preparation applications are TEM and APT specimen fabrication. Thanks to its high-resolution SEM column and STEM detector, our new instrument allows, site-specific sample preparation with high precision. It also enables automatic TEM sample preparation for high throughput applications.
In contrast to the sample preparation, the microscopy applications of the FIB/SEM dual beam can provide analytical information without the need for an additional technique. Main examples of microscopy applications are cross-sectioning and FIB/SEM tomography. These applications combined with information from our EDS system, incorporated into the dual beam, allow to obtain 3D-compositional information. Another aspect of FIB/SEM application is its micro machining, where the FIB/SEM system is used to create microscale structures or deposit conductive lines. FIB/SEM micro-machining can be used to create micro-electromechanical systems (MEMS) which are micro-scale devices with moving parts. With improvement in FIB and SEM resolution a field of nano-machining is also emerging.